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Technologies

Semiconductor packaging, LED Chip-on-Board engineering, wavelength development, memory-module manufacturing and electronics integration — developed together rather than in isolation.

Packaging

Advanced semiconductor packaging

Packaging determines how much of a die’s designed performance survives into the finished product. The work is thermal, mechanical and optical at once: how heat leaves the junction, how the assembly behaves through thermal cycling, and how light escapes the package.

POLYMATECH packaging lines are automated end to end, with robotic handling through placement and attach. Consistency between the first unit and the hundred-thousandth is a function of the process rather than of operator skill.

SUBSTRATE EMITTER HEAT PATH: JUNCTION TO BOARD NO BOND WIRE
Flip-chip construction — schematic

Chip-on-Board

Flip-chip LED and Chip-on-Board engineering

In a flip-chip arrangement the die is mounted face down and connected directly to the substrate. There are no bond wires to fail, and the thermal path from junction to board is shorter.

  1. Substrate selection

    Thermal conductivity, expansion match and dielectric behaviour assessed against the intended drive conditions.

  2. Die placement

    Automated placement against fiducial registration, holding array geometry within the tolerance the optical design assumes.

  3. Interconnect and attach

    Direct die-to-substrate connection, removing the wire bond as a failure mode.

  4. Optical layer

    The conversion or window layer specified for the target emission and for stability under the relevant wavelength.

  5. Test and binning

    Electrical and optical characterisation, with parts grouped so a customer receives a consistent population.

Wavelength

Specialised wavelength development

Most of the portfolio exists because a customer needed a band that standard illumination parts do not serve — a curing chemistry with a defined absorption peak, a sensing system tuned to a specific tissue response, a growth recipe for a particular crop.

Development covers emitter selection, package design for that wavelength, and the measurement work required to demonstrate that the part does what the application needs.

Thermal & optical

Optical and thermal management

Optical output and junction temperature are the same problem viewed from two directions. Substrate, interface material, package geometry and secondary optics are decided together, because a change to any one of them moves the others.

For high-density CoBs, where many die sit on a small footprint, this is the dominant engineering constraint.

Memory & electronics

Memory-module manufacturing and electronics integration

Automated memory-module assembly runs alongside the LED lines in Singapore, with in-process inspection and functional test built into the flow rather than added at the end.

Electronics integration covers the board, driver and control work that turns an emitter package into something an equipment maker can design around: interconnect, thermal interface, drive electronics and the mechanical envelope.

Inside manufacturing

In-line

Inspection built into the flow, not added after it

Binned

Parts grouped so a customer receives a consistent population

Automated

Robotic handling through placement and attach

Custom engineering

Custom product engineering

Two routes, depending on how much of the design already exists on your side.

Route A

OEM — build to your design

You hold the specification and the design. We manufacture to it, qualify against your acceptance criteria, and supply in volume.

Route B

ODM — develop it with you

You hold the requirement and the market. We take it through optical, thermal, electronic and package design to a qualified product you can ship under your own brand.

On specifications. Peak wavelength, flux, drive conditions, thermal limits and tolerances are defined per part on the datasheet issued for that product. Figures should be taken from the released datasheet rather than inferred from this page.